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CH

Thermal pad

Thermal Pad is a thermal conductive composite material with a certain thermal conductivity and flexibility. It is mainly used for gap filling between semiconductor devices and heat sinks, and improves the transfer efficiency of the heat generated by semiconductorsvduring operation.

Characteristics and advantages

● High thermal conductivity

● Low thermal impedence

● Application friendly

● Cost efficient

● High mechanical strength

● High breakdown voltage

● RoHS compliant

● Improve the interface thermal resistance and increase the heat source cooling rate

● Good compression property

● 1.7~15W/m-K range, wide range of softness


Obtain TDS

Application area

  • Smart phone

  • Tablet

  • Drone

  • Network terminal equipment

  • Smart wearable device

  • Communication equipment

  • Power electronics

  • Laptop

Subscribe information

亚博2021最新版官网 - YABO官方登录地址
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